Research Laboratory of Electronics (RLE)


Department of EECS Announces 2024 Promotions

February 28, 2024

The Department of Electrical Engineering and Computer Science (EECS) is proud to announce multiple promotions.

MIT community members elected to the National Academy of Engineering for 2024

February 14, 2024

Marc Baldo, Jacopo Buongiorno, and Hsiao-hua Burke, along with 13 additional MIT alumni, are honored for significant contributions to engineering research, practice, and education.

Scientists develop a low-cost device to make cell therapy safer

February 8, 2024

A plastic microfluidic chip can remove some risky cells that could potentially become tumors before they are implanted in a patient.

Study: Smart devices’ ambient light sensors pose imaging privacy risk

January 31, 2024

The ambient light sensors responsible for smart devices’ brightness adjustments can capture images of touch interactions like swiping and tapping for hackers.

Researchers safely integrate fragile 2D materials into devices

December 20, 2023

The advance opens a path to next-generation devices with unique optical and electronic properties.

Four from MIT awarded National Medals of Technology, Science

October 24, 2023

James Fujimoto, Eric Swanson, and David Huang are recognized for their technique to rapidly detect diseases of the eye; Subra Suresh is honored for his commitment to research and collaboration across borders.

Machine-learning system based on light could yield more powerful, efficient large language models

August 23, 2023

MIT system demonstrates greater than 100-fold improvement in energy efficiency and a 25-fold improvement in compute density compared with current systems.

3 Questions: What’s it like winning the MIT $100K Entrepreneurship Competition?

August 9, 2023

The founders of MIT spinout Active Surfaces describe their thin-film solar technology and their experience winning this year’s $100K.

MIT engineers “grow” atomically thin transistors on top of computer chips

May 2, 2023

A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.

Moving perovskite advancements from the lab to the manufacturing floor

April 20, 2023

U.S. Department of Energy selects MIT to establish collaborative research center for optimizing the development of tandem solar modules.