Nanoscale Materials, Devices, and Systems

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June 5, 2024

QS ranks MIT the world’s No. 1 university for 2024-25

Ranking at the top for the 13th year in a row, the Institute also places first in 11 subject areas.

May 3, 2024

QS World University Rankings rates MIT No. 1 in 11 subjects for 2024

The Institute also ranks second in five subject areas.

February 28, 2024

Department of EECS Announces 2024 Promotions

The Department of Electrical Engineering and Computer Science (EECS) is proud to announce multiple promotions.

February 8, 2024

New MIT.nano equipment to accelerate innovation in “tough tech” sectors

The advanced fabrication tools will enable the next generation of microelectronics and microsystems while bridging the gap from the lab to commercialization.

December 20, 2023

Researchers safely integrate fragile 2D materials into devices

The advance opens a path to next-generation devices with unique optical and electronic properties.

December 18, 2023

EECS Alliance Roundup: 2023

Founded in 2019, The EECS Alliance program connects industry leading companies with EECS students for internships, post graduate employment, networking, and collaborations. In 2023, it has grown to include over 30 organizations that have either joined the Alliance or participate in its flagship program, 6A.

December 15, 2023

Scientists 3D print self-heating microfluidic devices

The one-step fabrication process rapidly produces miniature chemical reactors that could be used to detect diseases or analyze substances.

November 29, 2023

Celebrating five years of MIT.nano

The Nano Summit highlights nanoscale research across multiple disciplines at MIT.

October 10, 2023

2023-24 EECS Faculty Award Roundup

This ongoing listing of awards and recognitions won by our faculty is added to all year, beginning in September.

May 2, 2023

MIT engineers “grow” atomically thin transistors on top of computer chips

A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.