The Department of Electrical Engineering and Computer Science (EECS) is proud to announce multiple promotions.
The advanced fabrication tools will enable the next generation of microelectronics and microsystems while bridging the gap from the lab to commercialization.
The advance opens a path to next-generation devices with unique optical and electronic properties.
Founded in 2019, The EECS Alliance program connects industry leading companies with EECS students for internships, post graduate employment, networking, and collaborations. In 2023, it has grown to include over 30 organizations that have either joined the Alliance or participate in its flagship program, 6A.
The one-step fabrication process rapidly produces miniature chemical reactors that could be used to detect diseases or analyze substances.
The Nano Summit highlights nanoscale research across multiple disciplines at MIT.
This ongoing listing of awards and recognitions won by our faculty is added to all year, beginning in September.
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
19th Microsystems Annual Research Conference reveals the next era of microsystems technologies, along with skiing and a dance party.
Luqiao Liu utilizes a quantum property known as electron spin to build low-power, high-performance computer memories and programmable computer chips.