The flexible chip could boost the performance of current electronics and meet the more stringent efficiency requirements of future 6G technologies.
đź“… Date: Tuesday, July 29, 2025đź•™ Time: 1:00 PM đź“Ť Location: Grier Room A (34-401A) / Zoom: https://mit.zoom.us/j/93908105610 Title: Reconfigurable and Interference-Tolerant Receivers for Next Generation Wireless Systems Abstract: An “all-in-one” radio,…
Time: July 16 at 3 pm Location: Room 3-133. Supervisors: Prof. Duane Boning and Prof. Carl Thompson. Title: Techniques for Reliability and Robustness in Integrated Electronic and Photonic…
A faculty member since 1994, Chandrakasan has also served as dean of engineering and MIT’s inaugural chief innovation and strategy officer, among other roles.
All promotions and appointments will take effect July 1, 2025.
Researchers developed a scalable, low-cost device that can generate high-power terahertz waves on a chip, without bulky silicon lenses.
Ranking at the top for the 13th year in a row, the Institute also places first in 11 subject areas.
The Institute also ranks second in five subject areas.
The Department of Electrical Engineering and Computer Science (EECS) is proud to announce multiple promotions.
Founded in 2019, The EECS Alliance program connects industry leading companies with EECS students for internships, post graduate employment, networking, and collaborations. In 2023, it has grown to include over 30 organizations that have either joined the Alliance or participate in its flagship program, 6A.