Selected:
![](https://www.eecs.mit.edu/wp-content/uploads/2023/05/MIT_2-D-Materials-01-PRESS_0-750x475.jpg)
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.