Department of EECS Announces 2024 Promotions
The Department of Electrical Engineering and Computer Science (EECS) is proud to announce multiple promotions.
The advanced fabrication tools will enable the next generation of microelectronics and microsystems while bridging the gap from the lab to commercialization.
Researchers safely integrate fragile 2D materials into devices
The advance opens a path to next-generation devices with unique optical and electronic properties.
EECS Alliance Roundup: 2023
Founded in 2019, The EECS Alliance program connects industry leading companies with EECS students for internships, post graduate employment, networking, and collaborations. In 2023, it has grown to include over 30 organizations that have either joined the Alliance or participate in its flagship program, 6A.
Scientists 3D print self-heating microfluidic devices
The one-step fabrication process rapidly produces miniature chemical reactors that could be used to detect diseases or analyze substances.
Celebrating five years of MIT.nano
The Nano Summit highlights nanoscale research across multiple disciplines at MIT.
2023-24 EECS Faculty Award Roundup
This ongoing listing of awards and recognitions won by our faculty is added to all year, beginning in September.
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
Student-led conference charts the future of micro- and nanoscale research, reinforces scientific community
19th Microsystems Annual Research Conference reveals the next era of microsystems technologies, along with skiing and a dance party.
Putting a new spin on computer hardware
Luqiao Liu utilizes a quantum property known as electron spin to build low-power, high-performance computer memories and programmable computer chips.