MIT Department of Electrical Engineering & Computer Science

Fabrication Techniques for Micro Electro Mechanical Systems

Martin A. Schmidt
M.I.T., EECS and MTL

Monday, October 26, 1998
4:00 PM (refreshments 3:45)
Edgerton Hall, Room 34-101
EECS Colloquium

Abstract

Micro Electro Mechanical Systems (MEMS) are constructed using a micro-lithographically-based manufacturing process. The MEMS technology is currently employed in a wide range of devices: microaccelerometers for crash detection in vehicles, pressure sensors for implantable medical devices, arrays of miniature mirrors for projection displays, and systems for chemical detection and assay. In the future, it is expected that the technology will continue to make in-roads into markets which are able to leverage the enabling elements of the technology. These include small size, low power consumption, ease of integration into arrays, potential for monolithic integration with electronics, and low cost in high volume. Application which are being pursued for the future include miniature drug delivery systems, artificially-structures cell-based systems, microturbine engines for power production, miniature autonomous vehicles (microairplanes), and massively parallel reactors for production of chemicals.

In view of the diversity of applications, MEMS is perhaps appropriately viewed as an enabling technology rather than an industry in and of itself. This talk will discuss new trends in the process technologies of MEMS. Particular emphasis will be placed on the development and manufacturing issues encountered in realizing a MEMS device. Specific examples from the MIT wafer bonding group will be utilized, including recent work in microturbine engines. The talk will conclude with a discussion of the challenges associated with the future commercialization of MEMS technology-based systems.