Monday, March 1, 1999
4:00 PM
Edgerton Hall, Room 34-101
EECS Colloquium
Abstract
As integrated circuit device densities increase, interconnect issues become more critical. This talk summarizes work my research group has been doing in two relatively new areas, both dealing with integrated circuit interconnect problems.
Work in our NSF/SRC Engineering Research Center on Environmentally Benign Semiconductor Manufacturing has been focusing on alternative chemistries for the Perfluorocompounds (PFCs) used heavily today in plasma etching and chamber cleaning. PFCs are perceived to be global warming agents and the semiconductor industry would like to minimize their emissions, while at the same time maintain the process performance, safety and cost advantages of PFCs.
The three dimensional integration project is part of a recently established multi-university Focus Center on Interconnects, and is exploring novel process architectures and technologies intended to keep interconnects short.
|
Modified: Feb 24, 1999|
Current events|
Your comments
and inquiries are welcome.