MIT Department of Electrical Engineering & Computer Science

Massachusetts Institute of Technology

MTL VLSI SEMINAR

Tuesday
November 8, 1994
3:30 Reception
4:00 Lecture
Room 34-101
50 Vassar Street

Progression of Multilevel Metallization Beyond 0.35 micron Technology

Fabio Pintchovski
Motorola, Inc.
Advanced Products Research and Development Laboratory
Austin, Texas

The technology leap from 0.35 um to 0.25 um design rules encompasses both new materials and process technologies. These new materials, finer pitches, additional levels of metal and increased interconnect density challenges lithographic and etch capabilities as linewidths shrink below 0.35 um. This talk addresses issues and approaches in integrating a 0.25 um multilevel metallization process module from the point of view of both new materials and new process technologies.