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MIT Electrical Engineering and Computer Science
EECS Event |
Tuesday, October 30, 2001
4:00 PM (reception 3:30)
Edgerton Hall, Room 34-101
MTL VLSI Seminar
Abstract
The next step in Moore’s law is the 0.1µm, or 100 nanometer process generation, which is the beginning of "nano-chips." In the nano-chip era, billions of transistors will power advanced devices, which will enable faster, more powerful chips with many more functions on each chip. In the nano-chip era, the three driving forces for the semiconductor industry are cost reduction through shrinking geometries and move to 300mm wafers, copper/Low _ interconnects, and advanced transistors.
Applied Materials has reengineered its entire product line to process 300mm wafers. We have also pioneered much of the copper/low _ technology, and are working with customers to ensure its commercialization. Applied Materials has also developed single-wafer thermal processes, along with implant technology, to help the semiconductor industry make ever-faster, smaller and reliable transistors.
The key to the semiconductor industry’s continued progression down the path of Moore’s law is the convergence of these three waves of technology: device shrinks, copper and low _ materials, and 300mm wafers. These trends are the foundation upon which nano-chips will become possible. A fourth wave, the integrated process modules, is a new paradigm shift for the semiconductor industry to meet the challenges of continued technical progression.
An Integrated Process Module begins with the process integration of two or more sequential systems, then, merges this process integration with metrology and inspection technologies for a wide range of film parameters and defects. Advanced Process Control (APC) software is employed in the module for close loop process control, and so is a module controller with feedforward/back capability to send information throughout the process module, enabling the module to operate as a single unit, with extremely high precision and productivity. Whereas the APC makes the individual system smart, the systems become truly intelligent when the module controller is employed to facilitate feedforward/feedback communications. This approach, now in initial commercialization, is expected to dramatically reduce the cycle time for new chip development and move the equipment industry up yet another notch on the value chain.