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MIT Electrical Engineering and Computer Science
EECS Event |
Tuesday, May 8, 2001
4:00 PM (reception 3:30)
Edgerton Hall, Room 34-101
MTL VLSI Seminar
Abstract
The CMOS transistor is on the verge of a fundamental change in structure. Silicon dioxide may soon be phased out as a gate dielectric to be replaced by a high-K material. This transition will require a huge amount of understanding of the material and device properties of the new gate dielectric material in a short period of time. The coordination of materials engineering, device engineering, process integration and reliability engineering will be necessary to achieve this feat. Several materials have been studied so far and the results from these will be discussed using available material and device data. The challenges of deposition and process integration will be also discussed.